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Fishing NZ Style
Excerpts from Latest (Expired) Patent
Application
NZ # 510157
Exploded View of the Insides of
an SS-XXYY Model G-Spot
Complete
SS-XXYY Model G-Spot
Obviously
low temperature heat-shrink isn't the most ideal
packaging to use, so a couple of injection molded plastic sleeves that
overlapped and interlocked could prove useful. For this to work as shown,
without a separate pouring hole for the resin, you will need to ensure that the
ring crimp terminal is of the 'open', rather than 'blind' type.
Conceptually
Useful Device.
I would love to hold one of these in my hands!
If practical, should reduce installation time further as negates the need to
strip ends of wire for connection purposes, conceptually achievable via pins
numbered 4 & 7. Size reduction also improves ability to conceal
further. Obviously if intended for use in high current situations, some
sort of built in thermal protection would be required and while I don't know about the finer details of the inner workings, if you can complete the design of a crimp in-line touch-sensitive 'thing' like
this and establish a method to mass manufacture it, I believe YOU WILL be doing
this world a great service.
Copy
of schematic for various basic G-Spot
models.
Number of required components and their values varies with the selection of output semiconductor,
Q1. If using appropriate SCR, only the core components of D1, R1, R2, R3,
R4, Q2, & C1 are required. Note: R4 is not featured in my animation as
it is an optional zero-ohm link for PCB design allowing for flexibility in model
production, depending on output semi-conductor availability. By the exclusion of R4 and the inclusion of the components R5,
R6, C2 & Q4, a device with 2 sensing points for the one load can be
created. R7 and the other components on the right hand side (excluding the
optional zero-ohm links R11 and R12, which may be incorporated, along with an
earthing wire. Theoretically this could be used to control a wider variety
of load types which do not operate with an uninterrupted flow of current - eg
fuel pumps, ignition coils - hence the earthing wire for maintaining current
flow through latching circuit or SCR) are for
creating a simple 'latching circuit' to lock the gate of a MOSFET on, if not
using an SCR.
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Other conceptually useful variations,
briefly covered in latest patent document.
I'm not sure, but it may be possible to use some sort of
thermally conductive board material instead of standard fiberglass and surface
mounted semi-conductors (D-PAK's) for the output semi-conductor. This
would considerably speed up the population of PCB's but may make achieving
external connectivity trickier. I'm sure those with more resources and
technical expertise than myself will be able to significantly improve on many
aspects of this products design, from it's overall robustness (current handling
capacity) to the speed at which it can be manufactured.
