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Excerpts from Latest (Expired) Patent Application
NZ # 510157
Exploded View of the Insides of
an SS-XXYY Model G-Spot
Complete SS-XXYY Model G-Spot
Obviously low temperature heat-shrink isn't the most ideal packaging to use, so a couple of injection molded plastic sleeves that overlapped and interlocked could prove useful. For this to work as shown, without a separate pouring hole for the resin, you will need to ensure that the ring crimp terminal is of the 'open', rather than 'blind' type.
Conceptually Useful Device.
I would love to hold one of these in my hands!
If practical, should reduce installation time further as negates the need to strip ends of wire for connection purposes, conceptually achievable via pins numbered 4 & 7. Size reduction also improves ability to conceal further. Obviously if intended for use in high current situations, some sort of built in thermal protection would be required and while I don't know about the finer details of the inner workings, if you can complete the design of a crimp in-line touch-sensitive 'thing' like this and establish a method to mass manufacture it, I believe YOU WILL be doing this world a great service.
Copy of schematic for various basic G-Spot models.
Number of required components and their values varies with the selection of output semiconductor, Q1. If using appropriate SCR, only the core components of D1, R1, R2, R3, R4, Q2, & C1 are required. Note: R4 is not featured in my animation as it is an optional zero-ohm link for PCB design allowing for flexibility in model production, depending on output semi-conductor availability. By the exclusion of R4 and the inclusion of the components R5, R6, C2 & Q4, a device with 2 sensing points for the one load can be created. R7 and the other components on the right hand side (excluding the optional zero-ohm links R11 and R12, which may be incorporated, along with an earthing wire. Theoretically this could be used to control a wider variety of load types which do not operate with an uninterrupted flow of current - eg fuel pumps, ignition coils - hence the earthing wire for maintaining current flow through latching circuit or SCR) are for creating a simple 'latching circuit' to lock the gate of a MOSFET on, if not using an SCR.
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Other conceptually useful variations,
briefly covered in latest patent document.
I'm not sure, but it may be possible to use some sort of thermally conductive board material instead of standard fiberglass and surface mounted semi-conductors (D-PAK's) for the output semi-conductor. This would considerably speed up the population of PCB's but may make achieving external connectivity trickier. I'm sure those with more resources and technical expertise than myself will be able to significantly improve on many aspects of this products design, from it's overall robustness (current handling capacity) to the speed at which it can be manufactured.
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